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Patent Number:
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WO/2008/032573
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Inventors:
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SHIGEMATSU, Toru [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
TAGAMI, Yuji [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
SAKAKIBARA, Michihiro [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
KONDO, Makoto [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
FUKUDOME, Shinichi [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
YASUDA, Tadayuki [JP/JP]; c/o NISSHIN FOODS INC., Institutional Product Sales Dept., Sales Division, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
WATANABE, Yasuhisa [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
NOMURA, Kumi [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
ITO, Eiichi [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
OBARA, Mie [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
INAGAKI, Yasuo [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP).
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Applicant:
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NISSHIN FOODS INC. [JP/JP]; 25, Kanda-Nishiki-cho 1-chome, Chiyoda-ku, Tokyo, 1018441 (JP) (All Except US).
SHIGEMATSU, Toru [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
TAGAMI, Yuji [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
SAKAKIBARA, Michihiro [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
KONDO, Makoto [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
FUKUDOME, Shinichi [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
YASUDA, Tadayuki [JP/JP]; c/o NISSHIN FOODS INC., Institutional Product Sales Dept., Sales Division, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
WATANABE, Yasuhisa [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
NOMURA, Kumi [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
ITO, Eiichi [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
OBARA, Mie [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
INAGAKI, Yasuo [JP/JP]; c/o NISSHIN FOODS INC., FOOD RESEARCH & DEVELOPMENT CENTER, 19-12, Koami-cho, Nihonbashi, Chuo-ku, Tokyo, 1038544 (JP) (US Only).
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Publication Date:
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20/03/2008
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Application Number:
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PCT/JP2007/066768
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Filed:
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29/08/2007
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A wet heat-treated wheat flour for wheat flour-containing foods such as breaded fried foods, fried foods, okonomiyaki (a Japanese style pancake), bakery, sauces and flour pastes, which is a wet heat-treated wheat flour characterized by having a gelatinization degree &agr; of 12.5% or more but not more than 30% and, after adding 300% by mass (based on the flour) of water, showing a viscosity of 1 Pa s or more but not more than 10 Pa s a mix or a food material containing the above wet heat-treated wheat flour; and a food produced by using the above wet heat-treated wheat flour. It is preferable that the wet heat-treated wheat flour as described above has a particle diameter of 1.0 mm or less and the ratio of wheat flour particles having a particle diameter of 0.40 mm or less amounts to 90% or more.
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